Solder Paste Inspection: 3D SPI

Solder Paste Inspection:
3D SPI

Objective and reproducible measurement results: 3D SPI systems from Koh Young

Has sufficient solder been applied or is the application excessive/insufficient? Is the pad evenly covered or are there defects? Optical inspection with a 3D SPI answers these questions. 3D SPI systems from Koh Young deliver consistent inspection quality and reproducible, objective and traceable inspection results based on real 3D measurement values.

SmartRep also offers the 3D AOI from world market and technology leader Koh Young in the field of optical inspection. 

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The advantages of the Koh Young 3D SPI

Precise error detection

The Koh Young 3D SPI makes use of piezo technology and the phase shift of the stripe grid shift to achieve maximum measurement accuracy and objective measurement results: The solder paste application is thus measured precisely and in height; the results are reproducible and are not influenced by shading or color differences. 

Targeted process optimization

3D SPI systems from Koh Young not only monitor the process, but also store the measurement results of each inspected board in a centralized location. The long-term quality of the process, recurring errors and trends are thus made visible. In-depth analyses and evaluations enable targeted intervention in the process - even before the error has occurred.

Process control

All types of errors in solder paste printing are detected immediately and faulty boards are sorted out. By using an inline 3D SPI, the process is permanently monitored: Trends can be identified and countermeasures can be taken at the printer before the process gets out of hand. 

Statistical traceability

When was which PCB with which barcode inspected by whom and how was it evaluated? The comprehensive data collection of Koh Young systems makes the process transparent.

Precise error detection

The Koh Young 3D SPI makes use of piezo technology and the phase shift of the stripe grid shift to achieve maximum measurement accuracy and objective measurement results: The solder paste application is thus measured precisely and in height; the results are reproducible and are not influenced by shading or color differences. 

Targeted process optimization

3D SPI systems from Koh Young not only monitor the process, but also store the measurement results of each inspected board in a centralized location. The long-term quality of the process, recurring errors and trends are thus made visible. In-depth analyses and evaluations enable targeted intervention in the process - even before the error has occurred.

Process control

All types of errors in solder paste printing are detected immediately and faulty boards are sorted out. By using an inline 3D SPI, the process is permanently monitored: Trends can be identified and countermeasures can be taken at the printer before the process gets out of hand. 

Statistische Nachverfolgbarkeit

When was which PCB with which barcode inspected by whom and how was it evaluated? The comprehensive data collection of Koh Young systems makes the process transparent.

Schematische Darstellung KPO

Automatic print process optimization

The SPI can do more than just check PCBs as a “good/bad” gatekeeper: With KPO, the Koh Young Process Optimizer for the printer, the SPI analyses the printing process and proactively regulates it using a variety of parameters before the values get out of hand and errors occur.

Areas of application of the 3D SPI

With an SPI system, presence checks can be carried out and defects in the solder paste application can be detected reliably and repeatably:

  • Bridges
  • Insufficient application
  • Excessive application
  • Volume errors
  • Form errors
  • Offsets

It is also possible to check the printed circuit board for foreign material and to perform a OCR test.

3D image of solder bridge

Solder Bridge

Volume error: Insufficient

Volume error: Excessive

Form error

Offset

Schematic representation of height measurement during bareboard teaching

Precise height and volume measurement

Height differences between pad and solder resist have no influence on the exact measurements of the SPI: With bareboard teaching, the unprinted PCB is measured by the SPI for height differences between pad and solder resist. To determine the exact volume and height of the solder paste, the SPI includes the results of the bareboard teaching in the measurements. 

Shadow-free measurement using strip grid projection

 In order to achieve reproducible 3D measurement results regardless of reflections and shadowing, Koh Young relies on multi-frequency moiré phase shift technology, in which a stripe grid is moved across the assembled PCB. When the pattern hits a component, the stripe grid shifts. The strength of the shift is directly dependent on the height of the component. Koh Young measures this displacement and uses it to calculate an exact 3D image of the measured object - regardless of color values, shading and reflections for a reproducible measurement result free of error slippage.

Schematic drawing of data collection in the Koh Young KSMART production line

Integrated into the KSMART-world

The KSMART tools are a collection of web-based applications developed by Koh Young that transform the 3D SPI from a quality control tool into a central starting point for cross-process improvements. Features of the KSMART tools include statistical process control, real-time monitoring and linking with other Koh Young systems in production.