3D SPI by Koh Young
With the combination of best technology, easy operation and a SPC-analysis software with many features, Koh Young sets the standard in 3D solder paste inspection: the system completely measures the solder paste in 3D and reliably detects all types of errors. Thanks to the broad possibilities for evaluation and analysis as well as to the possibility to interconnect all Koh Young systems, SPI systems made by Koh Young do not only improve your quality, but also your process.
INLINE 3D SPI
The inline-systems can easily be integrated into the production line and thus increase the process accuracy. With its reliable inspection results the SPI helps to identify weak points in the printing process.
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See the measuring accuracy of a Koh Young SPI with your own eyes during a demo - even directly on your own products!
Our 3D SPIs for reliable solder paste printing results
aSPIre3
The aSPIre3 provides outstanding measurement and repeatability required for measuring 03015M components in high volume production. aSPIre3 sets the standard in solder paste inspection by overcoming challenges such as shadowing, reflections and PCB warpage.
- Camera resolution of up to 10µm
- FoV: up to 61mm x 46mm
- Inspection speed of up to 58.5cm2 /Sek
- PCB size: up to max. 830mm x 690mm
8030-3
The 8030-3 impresses with its combination of throughput and speed: the system is twice as fast as its predecessor and loses nothing in terms of measuring accuracy.
- Camera resolution of up to 10µm
- FoV: up to 56mm x 57mm
- Inspection speed of up to 91,2cm2 /Sek
- PCB size: up to max. 850mm x 690mm
8030-2
Equipped with patented Moiré technology and 2-way projection, the system masters shadows and reflections without compromising measurement accuracy.
- Camera resolution of up to 10µm
- FoV: up to 50mm x 50mm
- Inspection speed of up to 59,5cm2 /Sek
- PCB size: up to max. 850mm x 690mm