Laser-depaneling by LPKF

Die patentierte CleanCut-Technologie des Herstellers LPKF reduziert die Karbonisierung auf Null und erhöht so die Lebensdauer von Leiterplatten. Da die Materialien beim Schnitt verschmelzen, wird ein Ausfransen der Schnittkanten verhindert. Die hohe Schnittqualität reduziert die Prozesskosten: Es sind keine Reinigungsschritte erforderlich.

Using a laser makes the depaneling process completely contact-free, thus no mechanical stress is transferred into the PCB and sensible components aren´t damaged. While mechanical depaneling processes generate dust, the laser evaporates the material which is then sucked off. Therefore, residues on the PCB are prevented.

Thanks to the narrow laser beam diameter of < 20µm and the flexible line the design possibilities are limitless: even very fine and complex structures can be implemented without any problems because it is not necessary to consider minimum radii or ridge widths.

To process different materials neither tool changes nor different systems are needed – simply adjusting the process parameters is sufficient. Systems by LPKF easily process materials like FR4 boards with up to 2mm strength, ceramics and FPCBs. 

The laser is almost completely wear-free, there is no need to replace tools like saw blades or milling heads. Costs for maintenance and spare parts are thus eliminated. 

Because laser technology means that only a minimal heat-affected zone has to be taken into consideration and the laser requires only a few µm as a cutting channel, the switch from a mechanical process to laser depaneling results in space savings of around 30 percent.

The integrated vision system uses fiducial marks to detect deformations or distortions in the material. During the cutting process, the laser beam follows the contours of the real component position. Laser systems from LPKF can thus produce standard-compliant panels from distorted base materials.

The CircuitPro software is an "all-in-one" solution that can be completely scaled according to your requirements: The software, which can be operated intuitively through user guidance, supports all common data formats for program creation and allows the processing of different material types and thicknesses. With different user levels, access to the software is regulated and a smooth production flow is ensured.

Traceability is always ensured: the laser systems can read and also generate 1D and 2D codes, identify bad boards, record process parameters and exchange information with your MES system.

All CuttingMaster models are available as a classic offline system with manual loading and unloading (model P) and as an inline system with automatic loading and unloading of the substrate that is to be separated.

All offline systems can be converted to an inline system at any time.