The MicroLine panel cutters are regarded as all-rounders: Depending on the configured laser source, they can be used to process flex, rigid-flex, FR4 up to 1.6 mm, LCP, PTFE, LCP, LTCC.

Flexibility, space savings, freedom of design – laser depaneling opens up numerous potentials. Because the laser beam requires only a few μm as a cutting channel, more individual circuits can be placed on a multiple panel. In addition, compared to mechanical separation processes, only minimal protection zones need to be set up between conductor paths and components. Both mechanical and thermal stress are significantly reduced when laser cutting PCBs.

We will be happy to find out together with you which laser system you need for the special requirements of your production! Whether an EMS service provider who must always be flexible or an LED specialist with particularly long boards – we have the right laser depanelling system for every requirement! Find the right contact person here…

LPKF can look back on over 40 years of experience as a technology and innovation leader and has its headquarters in Garbsen near Hanover, Lower Saxony. The systems are “Made in Germany” and offer intuitive operation, fast product changes and high process speeds.