KohYoung Inline 3D SPI

The inline 3D solder paste systems can easily be integrated in your production line. It will increase the process accuracy of your production. Depending on your process requirements you can choose different systems from Koh Young.

SmartRep offers you the ideal solution for your inspection process. Please take a look at our KohYoung SPI buffer system.

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Characteristics

  • Max. PCB-size: 510 x 510mm respectively Longboard-Option 1500 x 690mm
  • Measurement without shadows trough 2 / 4-way-projection
  • Highspeed 3D inspection
  • Koh Young patented Moiré analysis
  • Global Library
  • SPC Plus Software, offline programming, offline analysis

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