In 2009 KohYoung surprised the elctronic market as the entreprise presented the world first 3D AOI measurement system: Components and solder joints are measured at 100 persent in third dimension. The patented 3D technology shows results in measurementt and has been further developed within the last years. Challenges through shadow effect, warping of the PCB and different component supplier cope the machines like no other system. You want to know more about the Koh Young technology? Here you find a technical whitepaper…
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